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Technology

Samsung targets first quarter HBM4 deliveries for AI boom

congodailynews.comFebruary 9, 2026February 10, 2026
SEOUL: Samsung Electronics said it is on track to begin delivering its next-generation HBM4 high-bandwidth memory products in the first quarter of 2026. The company said the HBM4 lineup will include products with 11.7 gigabits-per-second performance, as...
111.7 Gbps20.7 TB HBM42nm foundry4nm base die580 TB/sadvanced packagingAI acceleratorsai chipsai serversbase diecontent syndication servicescryptowiredata centersDDR5dramenterprise SSDEuroWirehbm3eHBM4high-bandwidth memorymemory bandwidthMENA NewswiremicronnvidiaRubin NVL72samsungsamsung electronicssemiconductor supply chainsk hynixSouth Korea techstacked DRAMvendor allocationsVera Rubin
Microsoft launches Maia 200 chip for Azure AI inference
Technology

Microsoft launches Maia 200 chip for Azure AI inference

congodailynews.comJanuary 28, 2026January 28, 2026
MENA Newswire, SAN FRANCISCO: Microsoft on Jan. 26 introduced Maia 200, the second generation of its in-house artificial intelligence accelerator, built to run AI models in production across Azure data centres. The company said Maia 200 is designed...
3-nanometerai acceleratorai inferenceArizonaazureazure data centerscloud infrastructurecontent syndication servicescustom silicondatacenter hardwareEuroWirefp4fp8generative aihbm3ehigh-bandwidth memoryIowalarge-language modelsmaia 100maia 200maia sdkMENA NewswireMicrosoftmodel deploymentpetaflopsSan Franciscosramtsmcu.s. central
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OpenAI deals bring frontier AI to ADNOC and Abu Dhabi Government

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Chervon Names Jody Grimsley Senior National Account Manager

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